The semiconductor package materials business is led by only one or two companies worldwide that possess the technology center around Japan. Through ceaseless technological development and challenges, we are able to be Korea’s only semiconductor packaging partner and is working to set the global standard that goes beyond the production in Korea.
半导体封装素材事业是 在世界上只有以日本为中心的1～2个公司确保技术的领域， 我们以不断的技术开发与挑战精神来占据国内唯一的半导体封装伙伴的地位，因此现在，超越国产化以及指向世界为标准。
Our Lead On Chip (LOC) tape is a double-sided adhesive tape of high heat resistance to adhere the leadframe and chip in a MEMORY semiconductor package. Both sides of the polyimide film are composed of heat-resistant polyimide-type thermoplastic adhesive layers.
LOC (晶上贴) 胶片是种高耐热双面粘贴在記憶體半导体内的引线框架指面上，把晶片牢牢粘接。
| Use | 16–512 DRAM Memory 4–8 GB NAND Flash Memory SOJ, TSOP Package Power TR Package |
|---|---|
| Characteristic | Excellent punching (designed to generate minimum burr). Wide ranging working temperature. Excellent adhesiveness and even flow of adhesive. Contains minimum ion impurities. Stable storing at room temperature. |
| 使用 | 16–512 DRAM 记忆体 4–8 GB NAND Flash 记忆体 SOJ, TSOP 封装体 Power TR 封装体 |
|---|---|
| 特点 | 高耐热性 在冲撞装饰线工程中没有毛刺 在高温中也减少引线框架的扭曲 与铁丝的附着力优异 |
